Design of aluminum/polyimide stretchable interconnects investigated through in-situ testing

Emanuele Cattarinuzzi, Riccardo Lucchini, Dario Gastaldi, Pasquale Vena, Andrea Adami, Leandro Lorenzelli

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, the mechanics of Aluminum/Polyimide stretchable interconnects is investigated in relation to the structural design of the metal conductor. In-situ electron- and laser-scanning microscopy are combined with mechanical testing to perform both morphological and topographical analysis of failure mechanisms at the small scale. An interplay between interface delamination and metal film buckling is observed and connected to the mismatch between the kinematics of the polymer substrate and the meandering metal film. The role of the metal/polymer interface as a constraint to negotiate the aforementioned kinematics mismatch is discussed, suggesting the relevance of interface mechanics characterization in the view of reliable meander design.

Original languageEnglish
Title of host publicationProceedings of the 2015 18th AISEM Annual Conference, AISEM 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781479985913
DOIs
Publication statusPublished - Mar 23 2015
Event18th Conference on Sensors and Microsystems, AISEM 2015 - Trento, Italy
Duration: Feb 3 2015Feb 5 2015

Other

Other18th Conference on Sensors and Microsystems, AISEM 2015
Country/TerritoryItaly
CityTrento
Period2/3/152/5/15

Keywords

  • in-situ testing
  • interface delamination
  • stretchable electronics
  • thin-film buckling

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Science Applications

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