Development and characterization of touch sensing devices for robotic applications

Ravinder S. Dahiya, Maurizio Valle, Roberto Oboe, Davide Cattin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the development of touch sensing chips for robotic applications and the experimental results from touch sensing elements on the chip. The high resolution tactile sensing chips have overall dimension of 1.5 cm x 1.5 cm and consist of 25 touch sensing elements. The touch sensing elements on the chip are the POSFET (Piezoelectric Oxide Semiconductor Field Effect Transistor) devices, obtained by depositing piezoelectric polymer directly on to the gate area of MOS transistor. Each sensing element has an effective sensing area of 0.5 mm x 0.5 mm. The tactile sensing chips are suitable for fingertips of a robot where large numbers of sensors are needed in a small space (typically 1 cm x 1.5 cm). The tactile sensing elements on the chip have been experimentally evaluated in time and frequency domain. Typically, protective rubber films of materials like PDMS Polydimethylsiloxane) are used to improve robustness of the sensors, albeit, at the cost of reduced sensitivity. Such effects on the response of POSFET touch sensing elements are studied with PDMS films having different thicknesses.

Original languageEnglish
Title of host publicationIECON Proceedings (Industrial Electronics Conference)
Pages4245-4250
Number of pages6
DOIs
Publication statusPublished - 2009
Event35th Annual Conference of the IEEE Industrial Electronics Society, IECON 2009 - Porto, Portugal
Duration: Nov 3 2009Nov 5 2009

Other

Other35th Annual Conference of the IEEE Industrial Electronics Society, IECON 2009
CountryPortugal
CityPorto
Period11/3/0911/5/09

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Dahiya, R. S., Valle, M., Oboe, R., & Cattin, D. (2009). Development and characterization of touch sensing devices for robotic applications. In IECON Proceedings (Industrial Electronics Conference) (pp. 4245-4250). [5415057] https://doi.org/10.1109/IECON.2009.5415057