Effects of the thermal residual stress field on the crack propagation in graded Alumina/Zirconia ceramics

P. Vena, D. Gastaldi, R. Contro

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A numerical approach to study the crack propagation in symmetric step-wise graded Alumina/Zirconia composites subjected to a residual stress field is presented in this work. The finite element method is used to calculate the stress intensity factor for cracks developing from the surface and to determine the effects of the thermal residual stresses. The results show that a suitably conceived stacking sequence induces in the laminate a residual stress field able to provide increased toughness and reliability of the structure by making the crack propagation stable below a given threshold stress. Moreover a lower bound on stress, below which no crack propagation occurs, can be identified.

Original languageEnglish
Title of host publicationMaterials Science Forum
Pages177-182
Number of pages6
Volume492-493
Publication statusPublished - 2005
Event8th International Symposium on Multifunctional and Functionally Graded Materials, FGM2004 - Leuven, Belgium
Duration: Jul 11 2004Jul 14 2004

Publication series

NameMaterials Science Forum
Volume492-493
ISSN (Print)02555476

Other

Other8th International Symposium on Multifunctional and Functionally Graded Materials, FGM2004
CountryBelgium
CityLeuven
Period7/11/047/14/04

Keywords

  • Effective toughness
  • FEM
  • Graded ceramic composites
  • Residual stresses

ASJC Scopus subject areas

  • Materials Science(all)

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