Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability

M. Jablonski, R. Lucchini, F. Bossuyt, T. Vervust, J. Vanfleteren, J. W C De Vries, P. Vena, M. Gonzalez

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

This work investigates the impact of geometry on the reliability of a high conductivity, meandered, stretchable interconnect. Meandered copper conductor interconnects of varying geometries that have been encapsulated into a PDMS matrix, are evaluated for reliability under tensile stretching conditions to 10% elongation. We present results that support our earlier findings by experiment and FEM simulation. Following, we vary interconnect parameters related to the encapsulation geometry, such as encapsulation hardness, thickness and stretchable zone perimeter, to assess impact on fatigue life of the embedded meandered copper lines. Results confirm and refine the prior simulation findings. Combinations of interconnect geometry parameters critical for stretching reliability are identified. Among others, we find that the meander radius (R) and encapsulation thickness are strongly coupled, causing very large meanders with thick encapsulation to fail very early. We show that, depending on the design of the meander transition, the characteristic life of an interconnect can differ 50 times under moderate, 10% cyclic elongation. Finally, we indicate the significance of our findings for the design of reliable, stretchable electronic systems.

Original languageEnglish
Pages (from-to)143-154
Number of pages12
JournalMicroelectronics Reliability
Volume55
Issue number1
DOIs
Publication statusPublished - Jan 1 2015

Fingerprint

Encapsulation
meanders
Fatigue of materials
Geometry
geometry
elongation
Stretching
Copper
Elongation
copper
fatigue life
hardness
conductors
simulation
Hardness
Finite element method
conductivity
radii
matrices
electronics

Keywords

  • FEM
  • High conductivity
  • Meandered interconnect
  • SMI
  • Stretchable interconnect
  • Weibull analysis

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality

Cite this

Jablonski, M., Lucchini, R., Bossuyt, F., Vervust, T., Vanfleteren, J., De Vries, J. W. C., ... Gonzalez, M. (2015). Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability. Microelectronics Reliability, 55(1), 143-154. https://doi.org/10.1016/j.microrel.2014.09.009

Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability. / Jablonski, M.; Lucchini, R.; Bossuyt, F.; Vervust, T.; Vanfleteren, J.; De Vries, J. W C; Vena, P.; Gonzalez, M.

In: Microelectronics Reliability, Vol. 55, No. 1, 01.01.2015, p. 143-154.

Research output: Contribution to journalArticle

Jablonski, M, Lucchini, R, Bossuyt, F, Vervust, T, Vanfleteren, J, De Vries, JWC, Vena, P & Gonzalez, M 2015, 'Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability', Microelectronics Reliability, vol. 55, no. 1, pp. 143-154. https://doi.org/10.1016/j.microrel.2014.09.009
Jablonski, M. ; Lucchini, R. ; Bossuyt, F. ; Vervust, T. ; Vanfleteren, J. ; De Vries, J. W C ; Vena, P. ; Gonzalez, M. / Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability. In: Microelectronics Reliability. 2015 ; Vol. 55, No. 1. pp. 143-154.
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